Macom Technology Solutions Holdings Revenue, Net Income & 10-K Summary

What the company does

Designs, develops and manufactures differentiated RF and optical semiconductor products and solutions.
Serves three primary end markets: Industrial & Defense (I&D), Data Center, and Telecom.
Core capabilities include analog and mixed-signal circuit design, compound semiconductor fabrication (GaAs, GaN, InP and specialized silicon), advanced packaging, and back-end assembly and test.
Offers thousands of standard and custom devices across multiple product lines, including ICs, MMICs, diodes, switches, amplifiers, lasers, photonic components, and related subsystems.
Some product lines have long product life cycles (five to ten years, with some generating revenue for 20+ years); the company continues to develop new technologies for market needs.
Headquarters in Lowell, Massachusetts, with facilities across North America, Europe and Asia. Internal wafer fabrication operates in Lowell (MA) and RTP (NC), with additional facilities in Ann Arbor (MI) and Limeil-Brévannes (France). The company also uses external foundries and contract manufacturers under a fab-lite model.
Lowell and RTP facilities hold Trusted Foundry accreditation to support domestic supply requirements for U.S. I&D customers.

Industrial & Defense (I&D): radar, RF jammers, electronic countermeasures, secure communications, communications data links, sensors and military/aerospace applications. Products include standard and custom amplifiers, switch components, phase shifters and integrated modules.
Data Center: photonics and optoelectronic components for high-speed interconnects (100G, 200G, 400G, 800G, 1.6T, 3.2T and higher) including TIAs, modulator drivers, lasers, photodetectors, and related transceivers/packaged solutions.
Telecom: carrier infrastructure, 5G/6G, SATCOM, FTTx/PON and related optical and RF components (amplifiers, filters, phase shifters, switches, transceivers, etc.).
Major product families: amplifiers, lasers, PIN diodes, RF/microwave components, modulators and drivers, phase shifters, transimpedance amplifiers, MMIC power amplifiers, clock/data recovery, laser drivers, optical components (lasers, photodetectors, post amplifiers), RF switches, RF/power modules, and various passive components.
Key advantages: system-level RF design, integration across multiple process technologies (GaAs, GaN, InP, SiGe, silicon), and a portfolio positioned to enable complete opto-electronic/transceiver solutions.

Global, diversified customer base with more than 6,000 end customers.
Sales through a global multi-channel model: direct sales force, applications engineering, independent sales representatives, resellers and distributors.
2026 revenue mix:
- Resellers/distributors accounted for 47.6% of revenue in 2026 (32.3% in 2025; 29.3% in 2024).
- Top 25 direct customers accounted for 35.8% of revenue in 2026 (45.6% in 2025; 47.0% in 2024).
- No single direct customer accounted for 10% or more of revenue in 2026. Two resellers accounted for 20.3% and 14.3% of revenue in 2026; the largest reseller represented approximately 29.0% of accounts receivable as of October 2, 2026.
The company reports revenue concentration risk due to dependence on a limited number of large customers and hyperscale data center operators for Data Center products.

Fab-lite model combining internal fabrication and assembly/test with external foundries and contract manufacturers.
Internal facilities: Lowell (MA), RTP (NC), Ann Arbor (MI), and Limeil-Brévannes (France).
External sources include multiple foundries and contract manufacturers; raw materials and key wafer/package components are sourced from a broad supplier base.
Supplier concentration risks exist for some sole-source materials and processes, creating potential exposure to supply disruption, changes in yields, capacity, cost and delivery schedules.
Quality and regulatory certifications at various sites include ISO 9001, AS9100D, IATF16949, ISO 14001 and ANSI/ESD S20.20:2021.
The company maintains access to multiple process technologies and capacity while controlling quality, time-to-market and supply risk.

748 U.S. issued patents and 524 foreign issued patents; 188 U.S. and 242 foreign pending patent applications (as of October 2, 2026).
Patent expiration dates range from 2026 to 2045; no single expiring patent is considered material to the portfolio within the next twelve months.
Filings cover semiconductor devices, circuit design, manufacturing and wafer fabrication.
The business relies on both patents and trade secrets and includes customary indemnities in customer agreements.

December 2023: acquired certain assets and specified liabilities of the RF business of Wolfspeed (GaN-on-SiC portfolio); in 2025 assumed control of a wafer fabrication facility in RTP, NC.
November 2024: acquired ENGIN-IC, Inc. (fabless GaAs/GaN MMICs and related assemblies) with operations in Plano, TX and San Diego, CA.
May 2026: invested in IQE plc, acquiring approximately 12% of issued ordinary shares for £30.0 million, plus a five-year zero-coupon convertible loan note of £15.0 million, long-term supply agreements and board seats.
Strategy focuses on accelerating growth, expanding the technology portfolio and increasing addressable markets; transactions carry standard due diligence and integration considerations.

Approximately 2,100 employees worldwide (as of October 2, 2026), with about 800 in R&D.
Geographic distribution: roughly 75% in North America, 13% in Asia Pacific, 12% in Europe.
139 European employees were covered by collective bargaining agreements as of the same date.
The workforce is engineering-heavy with a substantial R&D commitment.

Research and development expense for fiscal year 2026: $285.8 million.
The company notes revenue concentration with top customers and reliance on distributors, which affects revenue visibility and risk.